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Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP 19ka LED Backlit Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
EL-MF877-00
Template Revision B
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium
coin or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
PSG instructions for this template are available at
EL-MF877-01
Quantity
of items
included
in product
3
0
0
1
0
13
1
2
0
0
0
0
0
Page 1
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Summary of Contents for HP 19ka
- Page 1 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
- Page 2 Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable)
-
Page 3: Mechanical Instructions
11. Mechanical Instructions Step Figure Description Push the Remove key to the Base remove the ASSY. base assy. Remove the Remove screws to the rear remove the cover rear cover... - Page 4 Remove Remove the the tapes tapes and and the the pins pins Remove Remove the screws screws...
- Page 5 Remove Remove the the FFC FFC cable cable Remove Remove the the Key keyboard Board.
- Page 6 Remove Remove the mainframe mainframe Remove the Mylar and screws to Remove remove the boards main board and power board...
- Page 7 mainframe mainframe Bezel Bezel...